Current Projects:

Currently, we are working with the Development Team at JMAR Technologies Systems Division in South Burlington, VT to create several custom PCBs for a specialized analyzer. Stop by later for an update and photos of this exciting new product.

Past Projects:

Here are some examples of designs that we have recently done, illustrating the wide range of our capabilities.

This first example is a daughter card. This card has a 0.8mm pitch BGA device on it with all of the support hardware. It is a 4 layer, double sided, mixed-technology design. The design has 5 mil lines on 5 mil spacing and uses 8 mil microvias to fan the part out.

Next, we have a small board with some interesting features. First of all, it is a 4 layer, double sided, mixed technology design. The board has a 0.5mm pitch TQFP device and uses 8 mil lines and 7 mil spacing. 8 mil microvias were used to save space. It also has an area with special parts used only for development. Due to the short timeline between development and field testing, the wing was set up in such a way that it could be cut off when the firmware was completed. The resulting board was then placed directly into the enclosure. The final measurements are 1.2" x 2".

This final example was developed for a high volume application. It is an 8 layer, double sided, mixed technology design. Besides the very tight mechanical constraints, the board had several challenging electrical constraints, including high current (> 50A peak), 40MHz signals, and high resolution analog traces (16bit). We worked with the staff at Delphi to ensure that the design met all of their standards for quality, manufacturing and test.

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